Fanless Embedded Box PC with Socket Type 12th Generation Intel® Processor
| 데이터시트 | |
|---|---|
| 매뉴얼 | |
| SYSTEM | |
| CPU | i9-12900E i7-12700TE i7-12700E i5-12500TE i5-12500E i3-12100TE i3-12100E G6900TE G6900E |
| CHIPSET | Intel H610E/Q670E |
| SYSTEM MEMORY | DDR5 4800MHz Slot x2, max up to 64GB |
| DISPLAY INTERFACE | HDMI Type A x2 for HDMI 1.4b DisplayPort x2 for DP1.4a |
| STORAGE DEVICE | 2.5” SATA-III Drive Bay x 2 (A2 sku supports RAID 0/1) M.2 2280 M key for NVMe SSD x 1 (extra heatsink is needed, refer to optional accessories) (A2 sku only) |
| ETHERNET | Intel® I210AT, 10/100/1000 Base-TX x 2 Intel® I219LM, 10/100/1000 Base-TX x 1 Intel® I226LM, 2.5GbE Base-TX x 1 |
| I/O | USB 3.2 Gen2 5Gbps x 4 (A1 sku) USB 3.2 Gen2 10Gbps x 8 (A2 sku) USB2.0 x 4 (A1 sku) Audio x 1 (MIC-in, Line-out) DB-9 x 6 for RS-232/422/485 SMA Antenna Hole x6 DIO x 8 |
| EXPANSION | M.2 2230 E-Key x 1 for WiFi module M.2 3052 B-Key x 1 for 4G / 5G module |
| INDICATOR | System LED x 1 HDD LED x 1 |
| OS SUPPORT | Windows® 10 IoT Enterprise 64-bit Windows® 11 PRO 64-bit Linux Ubuntu 20.04 (Kernel 15.5 or above) |
| POWER SUPPLY | |
| POWER REQUIREMENT | 3-pin DC Input 12~24V |
| MECHANICAL | |
| MOUNTING | Wallmount |
| DIMENSIONS (W X H X D) | 10.39" x 3.8" x 7.33" (264mm x 80.92mm x 186.2mm) |
| GROSS WEIGHT | 10.4 lb (4.7 kg) |
| NET WEIGHT | 8.2 lb (3.7 kg) |
| ENVIRONMENTAL | |
| OPERATING TEMPERATURE | -4°F ~122°F (-20°C ~ 50°C), IEC68-2 with 0.5 m/s AirFlow, with wide temperature Memory / Storage (TDP 65W CPU) -4°F ~140°F (-20°C ~ 60°C), IEC68-2 with 0.5 m/s AirFlow, with wide temperature Memory (Max. 32G)/ Storage (TDP 35W CPU) |
| STORAGE TEMPERATURE | -40 °F ~ 176°F (-40°C ~ 80°C) |
| STORAGE HUMIDITY | 5 ~ 95% @ 40°C, non-condensing |
| ANTI-VIBRATION | 3 Grms/ 5 ~ 500Hz/ operation – SSD 1 Grms/ 5 ~ 500Hz/ operation – HDD |
| ANTI-SHOCK | 50G, IEC68-2-27, half sine, 11ms duration (with SSD) |
| CERTIFICATION | CE/FCC class A |
| PART NUMBER | BOXER-6645-ADS-A1-1010 | BOXER-6645-ADS-A2-1010 |
|---|---|---|
| PCH | H610E | Q670E |
| LAN | 4 | 4 |
| USB | USB 2.0 x 4 USB 3.2 (5Gbps) x 4 |
USB 3.2 (10Gbps) x 8 |
| RS-232 | — | — |
| RS-232/422/485 | 6 | 6 |
| DIGITAL I/O | 8 bit | 8 bit |
| AUDIO | Mic-in Line-out | Mic-in Line-out |
| STORAGE | 2.5” SATA-III Drive bay x 2 | 2.5” SATA-III Drive bay x 2(RAID 0/1) M.2 2280 M Key for NVMe SSD x 1 |
| DISPLAY | HDMI x 2 DP x2 | HDMI x 2 DP x2 |
| EXPANSION | M.2 E-Key 2230 x1 M.2 B-Key 3052 x1 w/ SIM Slot x1 |
M.2 E-Key 2230 x1 M.2 B-Key 3052 x1 w/ SIM Slot x1 |
| MOUNTING | Wallmount | Wallmount |
| POWER | 12~24V | 12~24V |
| OPERATION TEMP | -4°F ~122°F (-20°C ~ 50°C), IEC68-2 with 0.5 m/s AirFlow, with wide temperature Memory / Storage & TDP 65W CPU. -4°F ~140°F (-20°C ~ 60°C), IEC68-2 with 0.5 m/s AirFlow, with wide temperature Memory (Max. 32G)/ Storage & TDP 35W CPU |
-4°F ~122°F (-20°C ~ 50°C), IEC68-2 with 0.5 m/s AirFlow, with wide temperature Memory / Storage & TDP 65W CPU. -4°F ~140°F (-20°C ~ 60°C), IEC68-2 with 0.5 m/s AirFlow, with wide temperature Memory (Max. 32G)/ Storage & TDP 35W CPU |