패밀리사이트
PRODUCT
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UP SQUARED PRO TWL
UP Squared Pro TWL | SBC with Intel® Processor N-series and Intel® Core™ i3-N355 Processor
Intel® Processor N-series and Intel® Core™ i3-N355 Processor
Onboard LPDDR5 Memory up to 16GB
Onboard eMMC Storage up to 64GB
2.5GbE x 2 (Intel® I226-IT)
USB 3.2 x 3 (Type A x 2, Type C x 1)
40 Pin GPIO x 1
DP 1.2 x 1/DP 1.4a x 1/HDMI 2.0b x 1
RS232/422/485 Wafer x 2
M.2 2230 E-Key/M.2 2280 M-Key/M.2 3052 B-Key x 1
SATA 6Gb/s x 1
TPM 2.0
12V DC-in, 6A
Onboard LPDDR5 Memory up to 16GB
Onboard eMMC Storage up to 64GB
2.5GbE x 2 (Intel® I226-IT)
USB 3.2 x 3 (Type A x 2, Type C x 1)
40 Pin GPIO x 1
DP 1.2 x 1/DP 1.4a x 1/HDMI 2.0b x 1
RS232/422/485 Wafer x 2
M.2 2230 E-Key/M.2 2280 M-Key/M.2 3052 B-Key x 1
SATA 6Gb/s x 1
TPM 2.0
12V DC-in, 6A
| 데이터시트 |  UP Squared Pro TWL.pdf |
|---|---|
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제품상세정보
UP Squared Pro TWL – Advanced Performance Meets Developer Flexibility
The UP Squared Pro TWL is built for developers seeking a high-performance single board computer with advanced connectivity, AI readiness, and versatile deployment options. Powered by the Intel® Twin Lake platform—featuring the Intel® Core™ 3 Processor N355, Intel® Processor N250, or Intel® Processor N150—the board offers exceptional processing power in a compact 101.6mm × 101.6mm form factor. With robust OS support and a suite of advanced features, it’s an ideal platform for AI development, edge computing, and industrial-grade applications.
Optimized for Vision & Scalable AI Deployment
The UP Squared Pro TWL is purpose-built for vision-centric AI applications, featuring a 61-pin FPC connector for high-quality image acquisition and an M.2 2280 M-Key slot to integrate the Hailo-8™ AI accelerator. This configuration enables efficient, low-power inference—ideal for smart cameras and AI-based inspection systems. With USB 3.2 Gen 2 and dual LAN ports, it ensures smooth peripheral and sensor integration for industrial and embedded deployments.
Rich Multimedia & Future-Ready Performance
Delivering immersive graphics with triple 4K display support via HDMI 2.0b, DP 1.2, and DP 1.4a, the board is well-suited for real-time video analytics and advanced visual outputs in retail, healthcare, and factory automation. Its compact footprint, energy-efficient Intel® architecture, and broad I/O selection make it ideal for both rapid prototyping and full-scale deployment. The UP Squared Pro TWL provides developers with power, flexibility, and readiness for the edge.
Optional Accessories
| Part Number | Description |
| 1255X00032 | (TF)AC/DC Adapter.Input AC.100~240V.Output DC.12V.MAX 72W.6.0A.180D.W/ LOCK.EDAC. EA10681U(120) |
| 170X000799 | (TF)Power Cord. 3P. 125V. 10A. 180D. USA. 1. 8M. I-SHENG. SP305B/IS-14N SVT 18/3 60C CT-12 Black |
| 170X000800 | (TF)Power Cord. 3P. 250V. 10A. VDE. 1. 8M. I-SHENG. SP23/IS-14N H05VV-F 3G 0. 75 CT-12 Black |
| 170X000815 | (TF)Power Cord. 3P. 250V. 10A. 180D. CHINA. 1. 8M. I-SHENG. SP506A/IS-14N RVV 300/500V 3X0. 75 CT-12 Black |
| 170X000806 | (TF)Power Cord. 3P. 125V. 7A. 1. 8M. I-SHENG. U4NCB3T6B1218002. SP305B/IS-14N VCTF. Black. BSMI |
| 170X000803 | (TF)Power Cord.3P.125V/7A.PSE Certificate.1.8M.I-SHENG.U4NCB3P6C1218002.SP305B/IS-14N VCTF 0.75/3 Black 1.8M |
| 170X000810 | (TF)Power Cord.3P.250V.16A.Korea.1.8M.I-SHENG.SP23/IS-14N H05VV-F 3G 0.75 CT-12 Black |
| 170X000805 | (TF)Power Cord.3P.250V.10A.SWISS.1.8M.I-SHENG.SP-027C/IS-14N H05VV-F 3G 0.75mm CT-12 Black |
| 1709070500 | SATA cable |
| 1702150155 | SATA power cable (15cm) |
| 1702150306 | SATA power cable (30cm) |
| 1701100180 | COM Cable |
| UPCR-CAMB-A10-0001 | MIPI-CSI Camera RVP Converter Kit for UP Squared Pro 7000/UP Squared i12/UP Xtreme i12 |
| UPCR-HDMI-A10-0001 | HDMI IN carrier board for UP Squared Pro 7000/UP Squared i12/UP Xtreme i12 |
| UPCR-CAN1-A10-0001 | UP CAN Bus Carrier Board with USB/UART interface for UP product line |
| UPN-BRKIT-A10-0001 | Bracket KIT of board fixture for all UP series |
| UPN-ADLN01-COOLER-A01 | UPN-ADLN01.heatsink w/cooler.A1.0 |
SYSTEM
processorIntel® Core™ 3 Processor N355
Intel® Processor N250
Intel® Processor N150
Intel® Processor N250
Intel® Processor N150
GraphicsIntel®Graphics up to 32EU w/ INT8 extension
MemoryUp to 16GB onboard LPDDR5
StorageUp to 64GB onboard eMMC
I/OHDMI 2.0b x 1
DP 1.2 x 1
DP 1.4a via USB Type C
Audio Jack x 1 (Mic-in+Line-out)
RS-232/422/485 via 10 Pin header x 2
DP 1.2 x 1
DP 1.4a via USB Type C
Audio Jack x 1 (Mic-in+Line-out)
RS-232/422/485 via 10 Pin header x 2
CameraMIPI-CSI via 61-Pin FPC Connector x 1
USBUSB 2.0 x 2 (via 10 Pin Header x 1)
USB 3.2 Gen 2 (Type-A) x 2
USB 3.2 Gen 2 (Type-C) x 1
USB 3.2 Gen 2 (Type-A) x 2
USB 3.2 Gen 2 (Type-C) x 1
Expansion40 Pin GPIO x 1
M.2 2230 E-Key x 1 (CNVI, PCIe Gen 3 [x1], USB 2.0)
M.2 2280 M-Key x 1 (PCIe Gen 3 [x2])
M.2 3052 B-Key x 1 (USB 3.2 Gen 2 only) with Nano SIM slot (USB 3.0)
SATA 6Gb/s x 1
M.2 2230 E-Key x 1 (CNVI, PCIe Gen 3 [x1], USB 2.0)
M.2 2280 M-Key x 1 (PCIe Gen 3 [x2])
M.2 3052 B-Key x 1 (USB 3.2 Gen 2 only) with Nano SIM slot (USB 3.0)
SATA 6Gb/s x 1
Display InterfaceHDMI 2.0b x 1
DP 1.2 x 1
DP 1.4a via USB Type C
DP 1.2 x 1
DP 1.4a via USB Type C
Ethernet2.5GbE x 2 (Intel® I226-IT)
SecurityOnboard TPM 2.0
RTCYes
OS supportWindows 11 LTSC
Ubuntu 22.04/kernel 6.11+, ubuntu 24.04/kernel 6.11+
Yocto 5+
Ubuntu 22.04/kernel 6.11+, ubuntu 24.04/kernel 6.11+
Yocto 5+
POWER REQUIREMENT
Power12V DC-in
Power Supply TypeAT/ATX (ATX as default)
Power Consumption (Typical)TBD
MECHANICAL
Dimension4" x 4" (101.6mm × 101.6mm)
Net Weight0.44 lbs (0.20kg)
Gross Weight0.77 lbs (0.35kg)
ENVIRONMENT
Operating Temperature32°F ~ 140°F (0°C ~ 60°C) / 0.5 airflow, WiTAS1 -4°F ~ 158°F (-20°C ~ 70°C) with active cooler (project base)
Operating Humidity0% ~ 90% relative humidity, non-condensing
MTBFTBD
CertificationCE/FCC Class A, RoHS Compliant, REACH
