패밀리사이트

PRODUCT

제품소개

Motherboards

5.25” Compact Boards
EPIC Boards
3.5” SubCompact Boards
PC/104 Modules
Smart Display Modules
Pico-ITX Boards
Pico-ITX Boards-BIO
COM Express CPU Modules
COM Carrier Boards
ETX CPU Modules
ETX Carrier Board
RISC Board
Industrial Motherboards
Networking Motherboards
Full-size SBC-PICMG1.0 SBC
Half-size SBC-ISA
IoT Gateway/Node Boards
AI Edge Computing Solutions
UP Boards
de next
Server Board
UP SQUARED TWL
  • UP SQUARED TWL 첫번째 상세이미지 썸네일
  • UP SQUARED TWL 두번째 상세이미지 썸네일
  • UP SQUARED TWL 세번째 상세이미지 썸네일
  • UP SQUARED TWL 네번째 상세이미지 썸네일

UP SQUARED TWL

UP Squared TWL | Compact Fanless SBC with Intel® N-series SoC

Intel® Processor N-series SoC
Onboard LPDDR5 Memory up to 16GB
Onboard eMMC Storage up to 128GB
Gb Ethernet (full speed) RJ-45 x 2
USB 3.2 Type A x 3
40 pin GPIO x 1
DP 1.2, HDMI 2.0b, eDP 1.3
RS-232/422/485 x 2
M.2 2230 E-Key x 1
M.2 2280 M-Key x 1
TPM 2.0
12V DC-in
제품상세정보테이블
데이터시트 file1 UP Squared TWL.pdf
매뉴얼 file2 UP Squared TWL Manual 1st Ed.pdf
file2 첨부파일을 클릭하시면 다운받으실 수 있습니다!
제품상세정보

UP Squared TWL – Efficient, Flexible, and Developer-Friendly

The UP Squared TWL is the perfect single board computer for developers who demand high performance in a compact, cost-effective platform. Powered by the Intel® Twin Lake platform—featuring a choice of the Intel® Core™ 3 Processor N355, Intel® Processor N250, or Intel® Processor N150—it delivers modern processing capabilities while maintaining energy efficiency. Designed with a compact and fanless form factor, the UP Squared TWL provides silent, low-maintenance operation ideal for space-constrained deployments.

Optimized for Edge and Industrial Applications

With dimensions of just 85.6mm × 90mm, the UP Squared TWL offers a rich set of I/O features that make it a versatile solution for embedded and industrial use. It supports dual RS-232/422/485 connections for reliable serial communication, three USB ports for peripheral integration, and a 40-pin HAT interface delivering GPIO, SPI, I2C, I2S, and UART functions for broad customization options. Whether you’re developing IoT edge nodes, compact AI systems, or industrial automation platforms, the UP Squared TWL provides the flexibility and features required for a range of deployment scenarios.

Robust Connectivity and Scalable Design

Designed to support a variety of networking and expansion needs, the UP Squared TWL includes dual LAN ports and offers wireless expansion via M.2, ensuring reliable connectivity even in challenging environments. Its wide OS support and industrial-grade reliability make it a strong candidate for scalable solutions across retail, manufacturing, and smart city applications. Coupled with a compact footprint, balanced performance, and affordable pricing, the UP Squared TWL is ideal for both prototyping and full-scale deployment.

 

Optional Accessories

Part Number Description
1255X00032 (TF)AC/DC Adapter.Input AC.100~240V.Output DC.12V.MAX 72W.6.0A.180D.W/ LOCK.EDAC. EA10681U(120)
170X000799 (TF)Power Cord. 3P. 125V. 10A. 180D. USA. 1. 8M. I-SHENG. SP305B/IS-14N SVT 18/3 60C CT-12 Black
170X000800 (TF)Power Cord. 3P. 250V. 10A. VDE. 1. 8M. I-SHENG. SP23/IS-14N H05VV-F 3G 0. 75 CT-12 Black
170X000815 (TF)Power Cord. 3P. 250V. 10A. 180D. CHINA. 1. 8M. I-SHENG. SP506A/IS-14N RVV 300/500V 3X0. 75 CT-12 Black
170X000806 (TF)Power Cord. 3P. 125V. 7A. 1. 8M. I-SHENG. U4NCB3T6B1218002. SP305B/IS-14N VCTF. Black. BSMI
170X000803 (TF)Power Cord.3P.125V/7A.PSE Certificate.1.8M.I-SHENG.U4NCB3P6C1218002.SP305B/IS-14N VCTF 0.75/3 Black 1.8M
170X000810 (TF)Power Cord.3P.250V.16A.Korea.1.8M.I-SHENG.SP23/IS-14N H05VV-F 3G 0.75 CT-12 Black
170X000805 (TF)Power Cord.3P.250V.10A.SWISS.1.8M.I-SHENG.SP-027C/IS-14N H05VV-F 3G 0.75mm CT-12 Black
1701100180 COM Cable
170010015G UART to USB cable
9651210000 Wireless LAN Kit M.2 2230 802.11ax/ac/a/b/g/n + BT5.2,2.4G/5G/6G,with 2 sets of cable & antenna (Intel AX210)
9651885200 Wireless LAN Kit M.2 2230 802.11ax/ac/a/b/g/n + BT5.2,2T2R,with 2 sets of cable & antenna (Enli,ENL-8852CE)

SYSTEM

processorIntel® Core™ 3 Processor N355
Intel® Processor N250
Intel® Processor N150
(formerly Twin Lake)
GraphicsIntel® UHD Graphics for 12th Gen Intel® Processors
MemoryUp to 16GB LPDDR5
StorageUp to 128GB eMMC
I/OHDMI 2.0b x 1
DP 1.2 x 1
eDP 1.3 x 1
Audio wafer (Line out + MIC in) x 1
RS-232/422/485 via wafer x 2
Camera
USBUSB 2.0 x 2 (from 10 pin wafer x 1)
USB 3.2 Gen 2 Type A x 3
Expansion40 pin GPIO x 1
M.2 2230 E-Key x 1 (PCIe [x1], USB 2.0)
M.2 2280 M-Key x 1 (PCIe [x2])
Display InterfaceHDMI 2.0b x 1
DP 1.2 x 1
eDP 1.3 x 1
EthernetGb Ethernet (full speed) RJ-45 x 2
SecurityOnboard TPM 2.0
RTCYes
OS supportMicrosoft Windows 10/11
Ubuntu 22.04 LTS
Yocto 5.1

POWER REQUIREMENT

Power12V DC-in
Power Supply TypeAT/ ATX (ATX as default)
Power Consumption (Typical)15W~37W

MECHANICAL

Dimension3.37" x 3.54" (85.6 mm × 90 mm)
Net Weight0.41 lbs (0.19kg)
Gross Weight0.66 lbs (0.3kg)

ENVIRONMENT

Operating Temperature32°F ~ 140°F (0°C ~ 60°C) / 0.5 airflow, WiTAS1 -4°F ~ 158°F (-20°C ~ 70°C) with active cooler
Operating Humidity0% ~ 90% relative humidity, non-condensing
MTBF1,224,238
CertificationCE/FCC Class A, RoHS Compliant, REACH